hotmelt adhesive glue granule

hotmelt adhesive glue granule: Excellent adhesion laundry&dry cleaning resistance solvent resistance/instant solidifying.

hotmelt adhesive glue granule

Polyamide hot melt adhesive resin Technical Data Sheet

update: 2012.03.23

Reference Product properties		HT-8113
Appearance Form		Granule
Components		COPA(Copolyamide)
Optical Brightener Additives		Yes
Melting range      (°C)		125-135
Melt-index           (g/10min) (160°C/21.18N)		35-45
Density                      (g/cm3)		1.1
Specifications	Granule	Φ(3-4)×(5-6)mm
	Powder Particle sizes	0-80µm
		0-120µm
		0-160µm
		80-170µm
		80-300µm
Bonding condition  (for reference only)	Temperature (°C)	135-155
	Press (kg/cm2)	1.5-2.0
	Time (S)	10-15
Laundry resistance	40°C	excellent
	60°C	excellent
	90°C	good
Dry-cleaning resistance		excellent

The characteristic and application of COPA granule:

The melting range is within a small range, good adhesion, excellent laundry resistance, solvent resistance and instant solidifying etc. The appearance of the granule is near clear and well-proportioned. It is user - friendly and convenient.

Application fields: garment, reflective materials, automotive and leather industries.

Factory:

R&D:

Deep cold pulverization:

Certification:

Exhibition:

hotmelt adhesive glue granule